Renesas Electronics: Sr Process Engineer — Nakatsu, Japan

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Sr Process Engineer in Nakatsu, Japan, under reference 20034705_2026-10-13. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 23 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• AI、HPC（High Performance Computing）、車載およびIoT向けの先端半導体パッケージ（Flip Chip Chip Scale Package、Flip Chip Ball Grid Array、パワー半導体パッケージなど）の半導体後工程（アセンブリ・パッケージング）における技術開発業務を担当いただきます。
• ・VPS、FCCSP、FCBGAなどの先端パッケージ向け組立技術開発、設備選定、導入
• ・組立工程（Molding 、Ball mount、Marking、PKG saw）の材料、プロセス開発、改善
• ・製造ラインの立ち上げ・量産移行支援
• 当社では、次世代パッケージ技術（Flip Chip、SiPなど）の開発を推進し、半導体後工程における技術革新を積極的に加速しています。特にAI・高性能コンピューティング（HPC）・車載・IoT市場の急速な成長に伴い、より高密度・高信頼性・高放熱性を実現する先進パッケージ技術への要求が高まっています。
• 近年、生成AIやデータセンター向け半導体の需要拡大を背景に、AI向けパワーデバイスおよび高性能プロセッサ向けパッケージ市場は大きな成長局面を迎えています。これに伴い、VPS Package（Vertical Power Supply Package）、FCCSP（Flip Chip Chip Scale Package）、FCBGA（Flip Chip Ball Grid Array）をはじめとする先端パッケージの開発案件が増加しており、技術開発スピードおよび開発規模はこれまで以上に拡大しています。
• 本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、ADAS・自動運転向けの高信頼性パッケージ、IoT向け小型化パッケージなど、業界最前線の技術開発に携わることができます。また、将来のAI社会や自動運転社会を支える半導体製品の競争力向上に直接貢献できる非常にやりがいの大きいポジションです。パッケージ技術の進化が半導体性能を左右する重要な時代において、製品開発の中核メンバーとしてグローバルな技術開発をリードする機会が期待されます。

Essential requirements and candidate background

• ・半導体後工程（組立・パッケージング）の技術開発経験（5年以上）
• ・Ball Mount/Reflow/Flux cleaning/Markingの何れかの工程の技術開発経験者（5年以上）
• ・後工程のFTA、5Why等を用いた不具合解析、改善の実務経験
• ・治工具の設計、最適化を含むCADでの設計経験
• ・IATF、JEDEC等の半導体技術規格の知識
• ・製品開発におけるPMの実務経験

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Nakatsu, Japan

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Sr Process Engineer vacancy is not an offer for reference 20034705_2026-10-13; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20034705_2026-10-13.

Compare your qualifications and experience with the essential conditions for the Nakatsu, Japan position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: AI

An AI-related example should make the task and evaluation explicit. Explain the inputs, the system’s intended output and how you checked errors, usefulness or reliability, rather than relying on the model name alone.

Relevant skills

• AI/ML
• AI