Renesas Electronics: Semiconductor Assembly Process Technology Development Senior Engineer — Nakatsu, Japan

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Semiconductor Assembly Process Technology Development Senior Engineer in Nakatsu, Japan, under reference 20034707_2026-10-13. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 22 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• Development, equipment selection, and implementation of assembly technologies for advanced packages such as VPS, FCCSP, and FCBGA
• Development and improvement of materials and processes for assembly processes (SMT, SPI, AOI, Flip Chip bonding, Flux cleaning)
• Support: for Launching and Transitioning to Mass Production Lines
• Process quality and yield improvement activities
• Ou company is driving innovation in semiconductor packaging technologies including Flip Chip, SiP, VPS, FCCSP, and FCBGA
• As demand continues to grow in AI, HPC, automotive, and IoT applications, advanced packages with higher density, improved thermal performance, and greater reliability are becoming increasingly important
• To support the rapid expansion of these technologies, we are seeking experienced engineers in semiconductor assembly and packaging processes
• In this role, you will contribute to the development of next-generation packages for AI/HPC, ADAS, and other advanced applications, from package design and process development to product launch
• This is an opportunity to work on cutting-edge semiconductor technologies and play a key role in shaping future innovations

Essential requirements and candidate background

• Over 5 years of experience in technology development in semiconductor back-end processes (assembly and packaging)
• Over 5 years of technical development experience in any of the following processes: SMT, SPI, AOI, Flip Chip bonding, or Flux cleaning
• Practical experience in process improvement, quality control, and equipment introduction
• Technical Degrees (mechanical, materials, electronics, chemistry, etc.)
• Business-level proficiency in both Japanese and English

Preferred experience and additional strengths

• Practical experience in analyzing and improving defects using FTA, 5Whys, etc. in subsequent processes
• Experience: materials development such as material selection and optimization
• Experience: CAD design, including jigs and tool design and optimization
• Knowledge: semiconductor technology standards such as IATF and JEDEC
• Practical experience as PM in product development

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Nakatsu, Japan

Conditions requiring the complete notice

Some passages contain complex or combined conditions that have not been reduced to short eligibility statements here. Read the complete linked notice for those passages, including any alternatives, exceptions or restrictions. The concise facts above should not be treated as the full wording of every condition.

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Semiconductor Assembly Process Technology Development Senior Engineer vacancy is not an offer for reference 20034707_2026-10-13; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20034707_2026-10-13.

Compare your qualifications and experience with the essential conditions for the Nakatsu, Japan position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: AI

An AI-related example should make the task and evaluation explicit. Explain the inputs, the system’s intended output and how you checked errors, usefulness or reliability, rather than relying on the model name alone.

Relevant skills

• AI/ML
• AI
• CAD
• quality control
• process improvement
• chemistry